DP

DongSam Park

SC Stats Chippac: 2 patents #13 of 53Top 25%
Overall (2023): #160,108 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11823973 Package with compartmentalized lid for heat spreader and EMI shield KyungOe Kim, Woojin Lee 2023-11-21
11670563 Thermally enhanced FCBGA package KyungOe Kim, Wagno Alves Braganca, JR. 2023-06-06