Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11795525 | Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof | Naoki Miyashima, Takanori Kobayashi, Kazunari Maki, Shinichi Funaki, Yuki Ito | 2023-10-24 |
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more | 2023-10-17 |
| 11732329 | Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat-diffusing substrate | Hirotaka Matsunaga, Yuki Ito, Hiroyuki Matsukawa | 2023-08-22 |
| 11735575 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Takashi Hisada | 2023-08-22 |
| 11735529 | Side pad anchored by next adjacent via | Takahito Watanabe, Risa Miyazawa | 2023-08-22 |
| 11725258 | Copper alloy for electronic/electrical devices, copper alloy planar bar stock for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar | Hirotaka Matsunaga, Yuki Ito, Hiroyuki Matsukawa | 2023-08-15 |
| 11660026 | Restoring a wearable biological sensor | Keiji Matsumoto, Takahito Watanabe, Eiji Nakamura, Patrick Ruch | 2023-05-30 |
| 11655523 | Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar | Hirotaka Matsunaga, Kenichiro Kawasaki, Kazunari Maki, Yoshiteru Akisaka | 2023-05-23 |
| 11652115 | Solid-state imaging device and electronic apparatus | Tetsuya Uchida, Ryoji Suzuki, Yoshiharu Kudoh, Harumi Tanaka | 2023-05-16 |
| 11572460 | Thermoplastic elastomer for carbon fiber reinforced plastic bonding lamination | — | 2023-02-07 |
| 11574817 | Fabricating an interconnection using a sacrificial layer | Takahito Watanabe, Risa Miyazawa | 2023-02-07 |