Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848272 | Interconnection between chips by bridge chip | Akihiro Horibe, Toyohiro Aoki | 2023-12-19 |
| 11735575 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Hiroyuki Mori | 2023-08-22 |
| 11684988 | Prevention of dripping of material for material injection | Toyohiro Aoki, Eiji Nakamura | 2023-06-27 |