Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848272 | Interconnection between chips by bridge chip | Toyohiro Aoki, Takashi Hisada | 2023-12-19 |
| 11735575 | Bonding of bridge to multiple semiconductor chips | Takahito Watanabe, Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori | 2023-08-22 |
| 11637325 | Large capacity solid state battery | Kuniaki Sueoka, Takahito Watanabe | 2023-04-25 |
| 11574848 | Underfill injection for electronic devices | Kuniaki Sueoka | 2023-02-07 |