Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756922 | Hybrid bonding structure and hybrid bonding method | Ran He, Huifang Jiao, Yufeng Dai, Guanglin Yang, Ronghua Xie | 2023-09-12 |
CH
Chihon Ho
Overall (2023): #490,666 of 537,848Top 95%
1
Patents 2023