Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756922 | Hybrid bonding structure and hybrid bonding method | Ran He, Huifang Jiao, Yufeng Dai, Chihon Ho, Ronghua Xie | 2023-09-12 |
GY
Guanglin Yang
Overall (2023): #433,173 of 537,848Top 85%
1
Patents 2023