YD

Yufeng Dai

Huawei: 1 patents #1,187 of 3,461Top 35%
Overall (2023): #54,084 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11756922 Hybrid bonding structure and hybrid bonding method Ran He, Huifang Jiao, Guanglin Yang, Chihon Ho, Ronghua Xie 2023-09-12
11617587 Clamp Bingyue PAN, Zhijie Wang 2023-04-04
11602432 Valve clamping device Huixian Yang, Bingyue PAN, Tao Li 2023-03-14