KS

Kohei Seyama

SH Shinkawa: 4 patents #1 of 19Top 6%
TU Tohoku University: 1 patents #14 of 168Top 9%
Overall (2023): #44,299 of 537,848Top 9%
4
Patents 2023

Issued Patents 2023

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11769749 Mounting apparatus Tetsuya Utano 2023-09-26
11749541 Bonding apparatus Shigeyuki Sekiguchi, Yuji Eguchi 2023-09-05
11664344 Mounting apparatus Tetsuya Utano 2023-05-30
11569192 Method for producing structure, and structure Yuji Eguchi, Tomonori Nakamura, Hiroshi Kikuchi, Takehito Shimatsu, Miyuki UOMOTO 2023-01-31