Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749541 | Bonding apparatus | Shigeyuki Sekiguchi, Kohei Seyama | 2023-09-05 |
| 11569192 | Method for producing structure, and structure | Kohei Seyama, Tomonori Nakamura, Hiroshi Kikuchi, Takehito Shimatsu, Miyuki UOMOTO | 2023-01-31 |