Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11732123 | Thermosetting resin composition, and prepreg, laminate and printed circuit board using same | Huayong FAN, Yongjing XU, Jianlong Huang, Naidong SHE | 2023-08-22 |
| 11661378 | Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof | — | 2023-05-30 |
| 11649351 | Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same | Naidong SHE | 2023-05-16 |