Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11732123 | Thermosetting resin composition, and prepreg, laminate and printed circuit board using same | Zengbiao Huang, Huayong FAN, Jianlong Huang, Naidong SHE | 2023-08-22 |
| 11584851 | Resin composition, and prepreg and circuit material using the same | Jianying Shi, Weifeng YIN, Shanyin YAN | 2023-02-21 |