Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11732123 | Thermosetting resin composition, and prepreg, laminate and printed circuit board using same | Zengbiao Huang, Huayong FAN, Yongjing XU, Jianlong Huang | 2023-08-22 |
| 11649351 | Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same | Zengbiao Huang | 2023-05-16 |