Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772204 | Preform solder and method of manufacturing the same, and method of manufacturing solder joint | Shunsuke KOGA, Tomoki Sasaki, Yoshie Tachibana | 2023-10-03 |
| 11633815 | Solder paste | Toru Hayashida, Takashi Saito, Kanta Dei | 2023-04-25 |
| 11628520 | Preform solder and method of manufacturing the same, and method of manufacturing solder joint | Shunsuke KOGA, Tomoki Sasaki, Yoshie Tachibana | 2023-04-18 |
| 11607753 | Solder alloy, cast article, formed article, and solder joint | Takashi Saito, Takahiro Matsufuji, Naoko IZUMITA, Yuuki Iijima, Kanta Dei | 2023-03-21 |
| 11577344 | Solder alloy | Yuuki Iijima, Takashi Saito | 2023-02-14 |