Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11633815 | Solder paste | Toru Hayashida, Shunsaku Yoshikawa, Takashi Saito | 2023-04-25 |
| 11607753 | Solder alloy, cast article, formed article, and solder joint | Shunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji, Naoko IZUMITA, Yuuki Iijima | 2023-03-21 |