Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772204 | Preform solder and method of manufacturing the same, and method of manufacturing solder joint | Shunsuke KOGA, Yoshie Tachibana, Shunsaku Yoshikawa | 2023-10-03 |
| 11628520 | Preform solder and method of manufacturing the same, and method of manufacturing solder joint | Shunsuke KOGA, Yoshie Tachibana, Shunsaku Yoshikawa | 2023-04-18 |