Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712760 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Kaichi Tsuruta | 2023-08-01 |
| 11583959 | Solder alloy, solder power, and solder joint | Hiroyoshi Kawasaki, Masato Shiratori | 2023-02-21 |