Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712760 | Layered bonding material, semiconductor package, and power module | Masato Tsuchiya, Katsuji Nakamura, Osamu Munekata, Kaichi Tsuruta | 2023-08-01 |
| 11680319 | Atomic layer deposition device and atomic layer deposition method | Toshinori Miura, Mitsuru Kekura | 2023-06-20 |
| 11560622 | Degradable resin molding and production method for degradable resin molding | Toshinori Miura, Mitsuru Kekura | 2023-01-24 |