Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712760 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Osamu Munekata | 2023-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712760 | Layered bonding material, semiconductor package, and power module | Naoto Kameda, Masato Tsuchiya, Katsuji Nakamura, Osamu Munekata | 2023-08-01 |