DM

Dae Ho Min

SC Semes Co.: 1 patents #60 of 228Top 30%
Samsung: 1 patents #7,162 of 17,037Top 45%
📍 Seoul, KR: #3,051 of 7,884 inventorsTop 40%
Overall (2023): #471,399 of 537,848Top 90%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11600515 Die pickup module and die bonding apparatus including the same Chang Bu Jeong, Min-Gu LEE, Eui Sun Choi, Kang San Lee, Seung Dae Seok 2023-03-07