KL

Kang San Lee

HY Hyperconnect: 1 patents #5 of 19Top 30%
SC Semes Co.: 1 patents #60 of 228Top 30%
Samsung: 1 patents #7,162 of 17,037Top 45%
Overall (2023): #138,321 of 537,848Top 30%
2
Patents 2023

Issued Patents 2023

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11825236 Terminal and operating method thereof Sang Il Ahn 2023-11-21
11600515 Die pickup module and die bonding apparatus including the same Chang Bu Jeong, Min-Gu LEE, Eui Sun Choi, Dae Ho Min, Seung Dae Seok 2023-03-07