SS

Seung Dae Seok

SC Semes Co.: 1 patents #60 of 228Top 30%
Samsung: 1 patents #7,162 of 17,037Top 45%
📍 Yongin-si, KR: #1,315 of 2,785 inventorsTop 50%
Overall (2023): #260,616 of 537,848Top 50%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11600515 Die pickup module and die bonding apparatus including the same Chang Bu Jeong, Min-Gu LEE, Eui Sun Choi, Kang San Lee, Dae Ho Min 2023-03-07