Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817150 | Non-volatile memory with different word line hook up regions based on pass through signals | Shiqian Shao | 2023-11-14 |
| 11791327 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Akio Nishida | 2023-10-17 |
| 11792988 | Three-dimensional memory device with separated contact regions and methods for forming the same | Hiroyuki Ogawa | 2023-10-17 |
| 11758730 | Bonded assembly of a memory die and a logic die including laterally shifted bit-line bonding pads and methods of forming the same | Jee-Yeon Kim | 2023-09-12 |
| 11728305 | Capacitor structure including bonding pads as electrodes and methods of forming the same | Shiqian Shao, Peter Rabkin | 2023-08-15 |