Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791327 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Fumiaki Toyama | 2023-10-17 |
| 11587943 | Bonded die assembly using a face-to-back oxide bonding and methods for making the same | Masatoshi Nishikawa | 2023-02-21 |