Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610845 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Sangsoo Kim, Dong-Ju Jang | 2023-03-21 |
| 11581266 | Semiconductor package | Jongwan Kim, Juhyeon Oh, Yongkwan Lee | 2023-02-14 |