Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699626 | Semiconductor package and method of manufacturing the same | Hyun Ki Kim, Sang-Soo Kim, Seung Hwan Kim, Yong Kwan Lee | 2023-07-11 |
| 11610845 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang | 2023-03-21 |
| 11562965 | Semiconductor package | Sun Chul Kim, Sang-Soo Kim, Yong Kwan Lee, Hyun Ki Kim, Seok Geun Ahn | 2023-01-24 |