Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610845 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim | 2023-03-21 |
DJ
Dong-Ju Jang
Overall (2023): #461,330 of 537,848Top 90%
1
Patents 2023