Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764145 | Wiring structure having double capping structure, manufacturing method thereof, and integrated circuit chip having the same | Jaejin Lee, Hana Kim, Dongchan Lim | 2023-09-19 |
| 11700722 | Method for manufacturing a semiconductor device using a support layer to form a gate structure | Moonkeun Kim, Sukhoon Kim, Dongchan Lim | 2023-07-11 |