Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764145 | Wiring structure having double capping structure, manufacturing method thereof, and integrated circuit chip having the same | Jaejin Lee, Jaewha Park, Dongchan Lim | 2023-09-19 |
| D975049 | Speaker | Seokkyu Kang, Gangho Woo | 2023-01-10 |