Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11807518 | Multi-die integrated circuit package | Renata Melamud Berger, Ginel C. Hill, Paul M. Hagelin, Charles I. Grosjean, Aaron Partridge +1 more | 2023-11-07 |
| 11770112 | MEMS resonator with co-located temperature sensor | Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Partridge | 2023-09-26 |
| 11708264 | Stacked-die MEMS resonator | Pavan Gupta, Aaron Partridge | 2023-07-25 |
| 11685650 | Microelectromechanical structure with bonded cover | Aaron Partridge, Pavan Gupta | 2023-06-27 |