Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11807518 | Multi-die integrated circuit package | Ginel C. Hill, Paul M. Hagelin, Charles I. Grosjean, Aaron Partridge, Joseph C. Doll +1 more | 2023-11-07 |
| 11770112 | MEMS resonator with co-located temperature sensor | Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Aaron Partridge, Markus Lutz | 2023-09-26 |