Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830819 | Package comprising integrated devices and bridge coupling top sides of integrated devices | Bharani Chava, Abinash ROY, Jonghae Kim | 2023-11-28 |
| 11626359 | Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integration | Biancun Xie, Shree Krishna Pandey, Irfan Khan, Miguel MIRANDA CORBALAN | 2023-04-11 |
| 11552055 | Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods | Bharani Chava | 2023-01-10 |
| 11545555 | Gate-all-around (GAA) transistors with shallow source/drain regions and methods of fabricating the same | Peijie Feng, Kern Rim | 2023-01-03 |