Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830819 | Package comprising integrated devices and bridge coupling top sides of integrated devices | Abinash ROY, Stanley Seungchul Song, Jonghae Kim | 2023-11-28 |
| 11764186 | Package comprising an integrated device configured for shareable power resource | Abinash ROY | 2023-09-19 |
| 11749327 | Memory bit cell circuit including a bit line coupled to a static random-access memory (SRAM) bit cell circuit and a non-volatile memory (NVM) bit cell circuit and a memory bit cell array circuit | Khaja Ahmad Shaik | 2023-09-05 |
| 11710733 | Vertical power grid standard cell architecture | Hyeokjin Lim, Foua Vang, Seung H. Kang, Venugopal Boynapalli | 2023-07-25 |
| 11668735 | Granular sensing on an integrated circuit | Stefano Facchin, Baptiste Grave, David Jonathan Walshe | 2023-06-06 |
| 11645503 | Multibit neural network | Mohit Gupta, Wim Dehaene, Sushil Sakhare | 2023-05-09 |
| 11552055 | Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods | Stanley Seungchul Song | 2023-01-10 |