Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2023-02-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Sheng-Lin Ma, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2023-02-28 |