Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806751 | Wafer level ultrasonic device and manufacturing method thereof | Hung-Ping Lee | 2023-11-07 |
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Yu Jin, Sheng-Lin Ma, Qian Zhao, Huan Liu, Hung-Ping Lee +1 more | 2023-02-28 |
| 11548031 | Array-type ultrasonic sensor | Hung-Ping Lee | 2023-01-10 |