Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608550 | Hot working die steel with high thermal strength and high toughness and manufacturing process thereof | Qingchun Zhou, Weiming Xu, Jincai Gu, Jianhui Ge, Bowei Zhao +1 more | 2023-03-21 |
| 11590536 | Wafer level ultrasonic chip module and manufacturing method thereof | Yu Jin, Qian Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee +1 more | 2023-02-28 |