Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776837 | Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate | Shunsuke MORIYA, Kazuhiro Sawada | 2023-10-03 |
| 11732214 | Cleaning agent composition comprising an alkylamide solvent and a fluorine-containing quaternary ammonium salt | Hiroshi Ogino, Shunsuke MORIYA, Takahisa OKUNO | 2023-08-22 |
| 11592747 | Resist underlayer film-forming composition comprising carbonyl-containing polyhydroxy aromatic ring novolac resin | Yasunobu Someya, Ryo Karasawa, Keisuke Hashimoto, Rikimaru Sakamoto | 2023-02-28 |