Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776837 | Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate | Shunsuke MORIYA, Tetsuya Shinjo | 2023-10-03 |