Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721660 | Bonding wire for semiconductor devices | Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI | 2023-08-08 |
| 11612966 | Ag alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Motoki ETO, Takumi Ohkabe | 2023-03-28 |