TH

Teruo Haibara

NM Nippon Micrometal: 1 patents #3 of 8Top 40%
Overall (2023): #232,610 of 537,848Top 45%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11721660 Bonding wire for semiconductor devices Daizo Oda, Motoki ETO, Takashi Yamada, Ryo OISHI 2023-08-08