Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11722097 | Integrated circuit device and oscillator | — | 2023-08-08 |
| 11612966 | Ag alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Daizo Oda, Motoki ETO, Takumi Ohkabe | 2023-03-28 |