Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855065 | Stacked semiconductor die assemblies with support members and associated systems and methods | Hong Wan Ng | 2023-12-26 |
| 11824044 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Hong Wan Ng | 2023-11-21 |
| 11723150 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Hong Wan Ng, Hem Takiar | 2023-08-08 |
| 11710722 | Semiconductor assemblies with systems and methods for managing high die stack structures | Kelvin Tan Aik Boo, Chin Hui Chong, Hong Wan Ng | 2023-07-25 |
| 11658154 | Memory devices with controllers under memory packages and associated systems and methods | Hong Wan Ng | 2023-05-23 |
| 11562987 | Semiconductor devices with multiple substrates and die stacks | Chin Hui Chong, Hong Wan Ng, Hem Takiar, Kelvin Tan Aik Boo | 2023-01-24 |