Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723150 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2023-08-08 |
| 11710722 | Semiconductor assemblies with systems and methods for managing high die stack structures | Kelvin Tan Aik Boo, Seng Kim Ye, Hong Wan Ng | 2023-07-25 |
| 11562987 | Semiconductor devices with multiple substrates and die stacks | Hong Wan Ng, Hem Takiar, Seng Kim Ye, Kelvin Tan Aik Boo | 2023-01-24 |