Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11723150 | Surface mount device bonded to an inner layer of a multi-layer substrate | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2023-08-08 |
| 11710722 | Semiconductor assemblies with systems and methods for managing high die stack structures | Seng Kim Ye, Chin Hui Chong, Hong Wan Ng | 2023-07-25 |
| 11688662 | Thermal distribution network for semiconductor devices and associated systems and methods | Ling Pan, Sook Har Leong | 2023-06-27 |
| 11562987 | Semiconductor devices with multiple substrates and die stacks | Chin Hui Chong, Hong Wan Ng, Hem Takiar, Seng Kim Ye | 2023-01-24 |