Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810822 | Apparatuses and methods including patterns in scribe regions of semiconductor devices | Shigeru Sugioka, Keizo Kawakita, Tsung-Che Tsai | 2023-11-07 |
| 11769756 | Semiconductor assemblies with hybrid fanouts and associated methods and systems | Bharat Bhushan, Pratap Murali | 2023-09-26 |
| 11705432 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices | Hiroki Fujisawa, Shunji Kuwahara, Mitsuaki Katagiri, Satoshi Isa | 2023-07-18 |