Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705432 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices | Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri, Satoshi Isa | 2023-07-18 |
| 11646092 | Shared error check and correct logic for multiple data banks | Susumu Takahashi | 2023-05-09 |