Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705432 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices | Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri | 2023-07-18 |