Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11769770 | Methods of forming a semiconductor device having an air spacer | Yu-Lien Huang, Ching-Feng Fu, Huan-Just Lin | 2023-09-26 | $9,885,000 |
| 11761450 | Rotation locking system of motor of fan | Kun-Min Chen | 2023-09-19 | |
| 11626326 | Interconnect structures for semiconductor devices and methods of manufacturing the same | Yu-Lien Huang, Ching-Feng Fu, Huan-Just Lin | 2023-04-11 | $13,187,000 |
| 11621221 | Ball grid array package and package substrate thereof | Sung-Yuan Lin, Nai-Jen Hsuan, Yu Wang | 2023-04-04 |