Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621221 | Ball grid array package and package substrate thereof | Che-Ming Hsu, Nai-Jen Hsuan, Yu Wang | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621221 | Ball grid array package and package substrate thereof | Che-Ming Hsu, Nai-Jen Hsuan, Yu Wang | 2023-04-04 |