Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557558 | Structure of semiconductor device and method for bonding two substrates | Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Chien-En Hsu | 2023-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557558 | Structure of semiconductor device and method for bonding two substrates | Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Chien-En Hsu | 2023-01-17 |