Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569188 | Semiconductor device including elongated bonding structure between the substrate | Chung-Hsing Kuo, Ming-Tse Lin | 2023-01-31 |
| 11557558 | Structure of semiconductor device and method for bonding two substrates | Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Ming-Tse Lin, Chien-En Hsu | 2023-01-17 |